Build Engineer
Intellectual Capital Resources
An exciting opportunity for a Build Engineer has arisen with a cutting-edge AI hardware company developing next-generation processor technology, based in London.
This is a fantastic opportunity for a Build Engineer to join a growing engineering team working across silicon development, verification and physical design. You will be responsible for developing and supporting Python tooling, build systems and infrastructure that enable engineering teams to efficiently develop and optimise workloads throughout the chip lifecycle.
You will commit to a hybrid working model, required onsite 3 days a week.
Experience for the Build Engineer includes:
Software development with Python
Modern build systems, e.g. Bazel
Workload management, e.g. Slurm, LSF or SGE
Infrastructure as code or IAC, e.g. Ansible or Terraform
Containerisation, e.g. Docker
Desired: Experience supporting silicon EDA tooling or semiconductor workflows
If you are a Build Engineer looking for a new challenge within an ambitious AI hardware company at the forefront of semiconductor innovation, then please apply today or contact Tanny Sunderland to learn more.
This is a fantastic opportunity for a Build Engineer to join a growing engineering team working across silicon development, verification and physical design. You will be responsible for developing and supporting Python tooling, build systems and infrastructure that enable engineering teams to efficiently develop and optimise workloads throughout the chip lifecycle.
You will commit to a hybrid working model, required onsite 3 days a week.
Experience for the Build Engineer includes:
Software development with Python
Modern build systems, e.g. Bazel
Workload management, e.g. Slurm, LSF or SGE
Infrastructure as code or IAC, e.g. Ansible or Terraform
Containerisation, e.g. Docker
Desired: Experience supporting silicon EDA tooling or semiconductor workflows
If you are a Build Engineer looking for a new challenge within an ambitious AI hardware company at the forefront of semiconductor innovation, then please apply today or contact Tanny Sunderland to learn more.
Reference: WJ-5641_132274 · Posted 05 Nov 2026, 11:33 PM